TEI19
Cód:
491_9781450370684
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<p>Welcome to ACM TEI 2019, the 13th International Conference on Tangible, Embedded and Embodied Interactions, hosted in Tempe, Arizona, United States, from the 17th to the 20th of March 2019. The TEI conference features top-tier work that addresses issues of human-computer interaction, novel tools and technologies, interactive art, and user experience. The work presented at TEI has a strong focus on how computing can bridge atoms and bits into cohesive interactive systems.</p> <p>Over the past few years, TEI research has increasingly embraced hybridity, whether through material explorations of composites such as bioelectronic, on-body, or active materials, or theoretical inquiries into socio-technical systems as hybrid assemblies. Not confined to a single approach, we have seen advancements in new materials-such as conductive and thermochromic inks, OLEDs, biosensors, or bioelectronics-which have helped to embed computing in the physical world. Simultaneously, comparisons between tangible computing and crafting traditions-such as crocheting or weaving-have served to destabilize assumptions about 'low' and 'high' technologies, the cultures that surround them, and even which communities have been able to participate in the discussion. These hybrid, materially-oriented approaches are radically changing our understanding of what tangible interaction looks and feels like. The theme of Hybrid Materials will continue to catalyze this exciting trend of tangible interaction research at the intersection of social, technical, biological, and artistic systems.</p> <p>The intimate size of this single-track conference provides a unique forum for exchanging ideas and presenting innovative work through talks, interactive exhibits, demos, hands-on studios, posters, art installations and performances. TEI 2019 hosts a four-day program, starting on Sunday, March 17th with the Graduate Student Consortium and a series of five Studios that e
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